Core Technology:
Vacuum flow field and multi physics coupling algorithm based on computational fluid dynamics (CFD) and rarefied gas dynamics; Independently developed cross flow bidirectional coupling rapid convergence technology; Integrated technology of vacuum coating process+control+equipment; Plasma monitoring and data processing technology.
Differentiation advantage:
a. High precision: supports micrometer level channel simulation, and has obtained certain simulation verification in the preparation of nanoscale CVD thin films in the semiconductor field;
b. Targeted: Typically, fluid simulation is aimed at low vacuum, atmospheric pressure, or high-pressure fluids. Thin fluids under high vacuum involve cross flow problems, making simulation difficult. This project can simulate such cross flow scenarios.
c. Leading: Based on the surfacity platform, take the lead in establishing a cloud platform in the field of surface technology equipment, providing a digital foundation and engine for the digital transformation of the industry.
3. Technical Display

Figure 1 Simulation of Process Gas Flow Field for Semiconductor Spray Plate

Figure 2: Distribution of Thin Film Deposition Thickness Predicted by Convolutional Core Algorithm

Figure 3 Simulation results of process gas quality distribution of a certain equipment